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    Title :

    Thermal Reliability Prediction of Automotive Electronic Packaging


    Contributors:
    Pao, Y.-H. (author) / Jih, E. (author) / Reddy, V. (author) / SAE

    Conference:

    International congress ; 1995 ; Detroit; MI



    Publication date :

    1995-01-01


    Size :

    ALL


    Remarks:

    Paper nos 950023 to 951060 with gaps held only



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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    Thermal Reliability Prediction of Automotive Electronic Packaging

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