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    Title :

    2006-01-1613 Virtual Validation of Electronic System Packaging Using Reliability Criterion of an Electronic Component at its Solder Joint


    Contributors:

    Conference:

    Reliability and robust design in automotive engineering ; 2006 ; Detroit, MI



    Publication date :

    2006-01-01


    Size :

    6 pages


    Remarks:

    Held during the SAE 2006 world congress.



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English






    Nr. 1613

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    Electronic component reliability

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    München 1613.xml

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