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    Title :

    A study of electromagnetic and thermal coupling between electronic packages


    Contributors:

    Conference:

    6th Symposium on Multidisciplinary Analysis and Optimization ; 1996 ; Bellevue , WA , U.S.A.



    Publication date :

    1996-01-01



    Type of media :

    Conference paper


    Type of material :

    Electronic Resource


    Language :

    English




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