Transient thermal analysis for electronic packages
CHACKO, M. J., MANI, LEELAMMA, SHUKLA, K. N.
JOURNAL OF SPACECRAFT AND ROCKETS ; 24 , 2 ; 186-188
1987
Article (Journal)
Electronic Resource
English
A Study of Electromagnetic and Thermal Coupling Between Electronic Packages
British Library Conference Proceedings | 1996
|Thermal Characterization of Integrated Circuit Packages for Electronic Engine Control
SAE Technical Papers | 1997
|Thermal characterization of integrated circuit packages for electronic engine control
Automotive engineering | 1997
|Thermal Fatigue Analysis of PBGA Packages in Automotive Environment
SAE Technical Papers | 1998
|