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    Title :

    Transient thermal analysis for electronic packages


    Author / Creator :

    CHACKO, M. J., MANI, LEELAMMA, SHUKLA, K. N.


    Contributors:

    Published in:

    Publication date :

    1987-01-01


    Size :

    3 pages




    Type of media :

    Article (Journal)


    Type of material :

    Electronic Resource


    Language :

    English



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