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    Title :

    A Study of Electromagnetic and Thermal Coupling Between Electronic Packages



    Conference:

    Symposium; 6th, Multidisciplinary analysis and optimization ; 1996 ; Bellevue; WA



    Publication date :

    1996-01-01


    Size :

    6 pages


    Remarks:

    Paper nos 3980-4195; See also 6369.400F 96-3980 to 96-4195 1996 for papers on microfiche



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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