A Study of Electromagnetic and Thermal Coupling Between Electronic Packages
Symposium; 6th, Multidisciplinary analysis and optimization ; 1996 ; Bellevue; WA
1996-01-01
6 pages
Paper nos 3980-4195; See also 6369.400F 96-3980 to 96-4195 1996 for papers on microfiche
Conference paper
English
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