A study of electromagnetic and thermal coupling between electronic packages
6th Symposium on Multidisciplinary Analysis and Optimization ; 1996 ; Bellevue , WA , U.S.A.
1996-01-01
Aufsatz (Konferenz)
Elektronische Ressource
Englisch
A Study of Electromagnetic and Thermal Coupling Between Electronic Packages
British Library Conference Proceedings | 1996
|Transient thermal analysis for electronic packages
AIAA | 1987
|Bell housing packages, coupling systems presented
Online Contents | 1998
Thermal characterization of integrated circuit packages for electronic engine control
Kraftfahrwesen | 1997
|Thermal Management Simulations By Coupling of Different Software Packages to a Comprehensive System
SAE Technical Papers | 2005
|