Immersion Cooling of a Simulated Electronic Chip Protruding into a Flow Channel
J. E. Leland, L. C. Chow
Journal of Thermophysics and Heat Transfer ; 12 , 3 ; 398-405
1998
Article (Journal)
Electronic Resource
English
Boiling from the Top and Sides of a Protruding Simulated Electronic Chip
British Library Conference Proceedings | 1993
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