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    Title :

    Boiling from the top and sides of a protruding simulated electronic chip


    Contributors:
    LELAND, J. (author) / CHOW, L.C. (author)

    Conference:

    28th Thermophysics Conference ; 1993 ; Orlando , FL , U.S.A.



    Publication date :

    1993-01-01



    Type of media :

    Conference paper


    Type of material :

    Electronic Resource


    Language :

    English




    Boiling from the Top and Sides of a Protruding Simulated Electronic Chip

    Leland, J. E. / Chow, L. C. / AIAA | British Library Conference Proceedings | 1993





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