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    Title :

    Boiling from the Top and Sides of a Protruding Simulated Electronic Chip


    Contributors:

    Conference:

    28th Conference, Thermophysics ; 1993 ; Orlando; FL



    Publication date :

    1993-01-01


    Size :

    AIAA 93-2834


    Remarks:

    Separate papers nos 93-2720 to 93-2886 with gaps held only


    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English








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