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    Title :

    Direct wafer bonding of amorphous or densified atomic layer deposited alumina thin films


    Contributors:
    Beche, E. (author) / Fournel, F. (author) / Larrey, V. (author) / Rieutord, F. (author) / Fillot, F. (author)

    Published in:

    MICROSYSTEM TECHNOLOGIES ; 21 , 5 ; 953-959


    Publication date :

    2015-01-01


    Size :

    7 pages



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English


    Classification :

    DDC:    629.83



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