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    Title :

    Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation


    Contributors:
    Costello, S. (author) / Strusevich, N. (author) / Flynn, D. (author) / Kay, R. W. (author) / Patel, M. K. (author) / Bailey, C. (author) / Price, D. (author) / Bennet, M. (author) / Jones, A. C. (author) / Desmulliez, M. P. (author)

    Published in:

    MICROSYSTEM TECHNOLOGIES ; 19 , 6 ; 783-790


    Publication date :

    2013-01-01


    Size :

    8 pages



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English


    Classification :

    DDC:    629.83



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