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    Title :

    Megasonic agitation for enhanced electrodeposition of copper


    Contributors:
    Kaufmann, J. G. (author) / Desmulliez, M. P. (author) / Tian, Y. (author) / Price, D. (author) / Hughes, M. (author) / Strusevich, N. (author) / Bailey, C. (author) / Liu, C. (author) / Hutt, D. (author)

    Published in:

    MICROSYSTEM TECHNOLOGIES ; 15 , 8 ; 1245-1254


    Publication date :

    2009-01-01


    Size :

    10 pages



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English


    Classification :

    DDC:    629.83



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