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    Title :

    Shallow and deep dry etching of silicon using ICP cryogenic reactive ion etching process


    Contributors:
    Sökmen, . (author) / Stranz, A. (author) / Fündling, S. (author) / Merzsch, S. (author) / Neumann, R. (author) / Wehmann, H. H. (author) / Peiner, E. (author) / Waag, A. (author)

    Published in:

    MICROSYSTEM TECHNOLOGIES ; 16 , 5 ; 863-870


    Publication date :

    2010-01-01


    Size :

    8 pages



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English


    Classification :

    DDC:    629.83



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