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    Title :

    A GRINDING-BASED MANUFACTURING METHOD FOR SILICON WAFERS: GENERATION MECHANISMS OF CENTRAL BUMPS ON GROUND WAFERS


    Contributors:
    Sun, W. (author) / Pei, Z. J. (author) / Fisher, G. R. (author)

    Published in:

    Publication date :

    2006-01-01


    Size :

    16 pages



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English


    Classification :

    DDC:    671.35



    A GRINDING-BASED MANUFACTURING METHOD FOR SILICON WAFERS: DECOMPOSITION ANALYSIS OF WAFER SURFACES

    Lu, W. K. / Pei, Z. J. / Fisher, G. R. | British Library Online Contents | 2007


    Smoother Scribing of Silicon Wafers

    Danyluk, S. | NTRS | 1986


    Reciprocating Saw for Silicon Wafers

    Morrison, A. D. / Collins, E. R., Jr. | NTRS | 1985


    Automated Texturization of Silicon Wafers

    Chitre, S. / Snyder, C. / Jones, G. et al. | NTRS | 1985


    Laser scribing of silicon wafers

    Calihan, C. | NTRS | 1970