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    Title :

    A Stress Analysis of Large-Size Plastic Encapsulated Microelectronics with Thermal Cycle Test


    Contributors:
    Makihara, A. (author) / Ooura, A. (author) / Iwaoka, M. (author) / Sugimoto, K. (author) / Akutsu, T. (author) / Matsuda, S. (author)


    Publication date :

    1997-01-01


    Size :

    4 pages



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English


    Classification :

    DDC:    500.5 / 387.8



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