A Stress Analysis of Large-Size Plastic Encapsulated Microelectronics with Thermal Cycle Test
Conference; 3rd, Electronic components ; 1997 ; Noordwijk; The Netherlands
1997-01-01
4 pages
Also known as EECC'97
Conference paper
English
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A Stress Analysis of Large-Size Plastic Encapsulated Microelectronics with Thermal Cycle Test
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