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    Title :

    A Stress Analysis of Large-Size Plastic Encapsulated Microelectronics with Thermal Cycle Test


    Contributors:

    Conference:

    Conference; 3rd, Electronic components ; 1997 ; Noordwijk; The Netherlands



    Publication date :

    1997-01-01


    Size :

    4 pages


    Remarks:

    Also known as EECC'97



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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