Reliability of Commercial Plastic Encapsulated Microelectronics at Temperatures from 125^oC to 300^oC
Aerospace conference ; 2000 ; Big Sky, MT
2000-01-01
6 pages
IEEE cat no 00TH8484
Conference paper
English
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NTIS | 2017
|A Stress Analysis of Large-Size Plastic Encapsulated Microelectronics with Thermal Cycle Test
British Library Online Contents | 1997
|A Stress Analysis of Large-Size Plastic Encapsulated Microelectronics with Thermal Cycle Test
British Library Conference Proceedings | 1997
|