Access

    Access via TIB

    Check availability in my library

    Order at Subito €


    Export, share and cite



    Title :

    Reliability of Commercial Plastic Encapsulated Microelectronics at Temperatures from 125^oC to 300^oC



    Conference:

    Aerospace conference ; 2000 ; Big Sky, MT



    Publication date :

    2000-01-01


    Size :

    6 pages


    Remarks:

    IEEE cat no 00TH8484




    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English


    Keywords :




    Microelectronics Reliability

    C. Mayberry / J. Bernstein | NTIS | 2017


    A Stress Analysis of Large-Size Plastic Encapsulated Microelectronics with Thermal Cycle Test

    Makihara, A. / Ooura, A. / Iwaoka, M. et al. | British Library Online Contents | 1997


    A Stress Analysis of Large-Size Plastic Encapsulated Microelectronics with Thermal Cycle Test

    Makihara, A. / Ooura, A. / Iwaoka, M. et al. | British Library Conference Proceedings | 1997