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0.1 mu m InGaAs/InAlAs/InP HEMT MMICs - a flight qualified technology
3-layered 3D flex based MCM: electrical characterization and reliability issues
6H-SiC transistor integrated circuits demonstrating prolonged operation at 500 deg C
A case study of IC storage failures in Taipei trains
Accelerated testing of flip chip packages under dynamic load
Acceptance checking methods for UHF electronic components
A comparison of Si CMOS and SiGe BiCMOS technologies for automotive radars
Alternative solders for flip chip applications in the automotive environment
A new Ag/Pd conductor for automotive applications
A new methodology for SEE testing and simulations
An integrated chassis controller for automotive vehicle emulation
An On-Chip Power Supply Regulator to Reduce the Switching Noise
Anwendungen der Mikroelektronik in der Eisenbahntechnik
A performance measure for a VHSIC avionic system: mission dependent availability
A powertrain control SOI BiCMOS LSI for an automotive application
Armed forces communications and electronics association 28th annual convention
A simple computational electromagnetic analysis example of electromagnetic coupling to pyro circuits
Assessment of need for solder in modeling potted electronics during gun-shot
Automotive electronics: designing custom ICs for a harsh environment
Automotive Komponenten. Marktübersicht: Kfz-Halbleiter
Ball grid array reliability assessment for aerospace applications
Benchmarking Analysis of Space-Grade Central Processing Units and Field-Programmable Gate Arrays
Board-level characterization of 1.0 and 1.27 mm pitch PBGA for automotive under-hood applications
Cell-Based Architecture for Adaptive Wiring Panels: A First Prototype
Characteristics of devices and integrated circuits at 260 Cel for Navy applications
Commercial-Components Initiative: Ground Benign Systems-plastic encapsulated microcircuits
Cosmic-ray soft error rate characterization of a standard 0.6- mu m CMOS process
Demonstrated reliability of plastic-encapsulated microcircuits for missile applications
Design of fail safe computer systems for railway control
Die neue Vernetzung zwischen Automobilherstellern und ihren Zulieferern
Dispersion and the worst case of thermal fatigue life of solder joints in vehicle electronic devices
Effect of friction modifiers on wheel/rail isolation
Effect of post-mold curing of epoxy molding compound on wirebond reliability in a MOSFET
Eine neue Fehlertoleranzmethode zur Verringerung des Flächenaufwandes von TMR-Systemen
Electric Vehicles and the Environment
EMC-aware design on a microcontroller for automotive applications