Synonyme wurden verwendet für:
encapsulation
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keywords:(encapsulation)
3-layered 3D flex based MCM: electrical characterization and reliability issues
Accelerated testing of flip chip packages under dynamic load
Acceleration threshold switches from an additive electroplating MEMS process
An electrostatic accelerator for ultrahypervelocity microprojectiles
A Novel Technology for Thermal Control for ISP module for Space Applications
A study of chip top delamination in plastic encapsulated packages under temperature loading
Demonstrated reliability of plastic-encapsulated microcircuits for missile applications
Design and characteristics of submarine optical fiber cable
Heat transfer and thermal management of electric vehicle batteries with phase change materials
High density packaging for automotive applications
High efficiency, high reliability 2 kW inverter for aeronautical application
Innovative vibro-acoustic metamaterials to provide lightweight NVH solutions
Jet Blast Resistance Experiment of Engineered Material Arresting System
Long life radioisotopic power sources encapsulated in platinum metal alloys
Maximizing lumen output of LEDs for automotive exterior signal lighting applications
MEMS package in a harsh environment for aeronautic applications
Metal-enclosed, air-insulated traction switchgear - developments and applications
Microcoil speed position sensor for automotive applications
Microwave multichip modules using low cost microwave chip on flex packaging technology
Motorola and MEMMS: the way up to a surface micromachined accelerometer
New techniques and thermoplastics for encapsulating automotive sensors and solenoids
Noise reduction on trucks of 6 to 10 t gvw through engine encapsulation
Non-hermetic embedded MCM technologies for automotive and other lower cost applications
Novel composites for space microelectronics and optics
On the isolation of science payloads from spacecraft vibrations
Optimal sizing of powder handling horizontal capsule pipelines
Optimized cooling systems for high-power semiconductor devices
Performance of new silicone adhesives and encapsulants at high and low temperatures
Predicting, categorizing and intercomparing the lifetime of OPVs for different ageing tests