A new packaging solution for a MEMS pressure sensor has been developed which is based on a modular concept where the measurement unit is located in a quickly exchangeable sensor capsule. The electrical interconnection between capsule and rotor blade integrated housing is established by an elastic foil with anisotropic electric conductivity while the capsule is held inside the housing by a magnetic force resulting from two NdFeB permanent magnets. The reliability of this new interconnection concept is very important for the overall sensor functionality. As the MEMS pressure sensor is installed into a rotor blade, it will face several adverse effects like high amplitude vibrations of 20 g and strong centrifugal accelerations of 1000 g. It was shown that the sensor and its interconnection concept are reliable even under these harsh conditions and that the package concept finally can be used for a rotor blade integrated pressure sensor. Additionally, climatic conditions like the icing of water inside the sensor capsule are analyzed with a resulting sensor failure rate of 21 %. But the failure cause of the sensor membrane can be minimized or even eliminated by the proposed buffer concept.
MEMS package in a harsh environment for aeronautic applications
MEMS-Packung in harter Umgebung für Luftfahrtanwendungen
2008
8 Seiten, 9 Bilder, 4 Quellen
(nicht paginiert)
Aufsatz (Konferenz)
Englisch
NTRS | 1922
|Engineering Index Backfile | 1911
|