Using the new operating mode to automatic window controls from The Cherry Corp., USA, as an example, the author shows how automotive electronics producers must provide automobile manufactures with full component design, packaging, manufacturing and testing services. The choice of circuitry and packaging, the PC board design, construction, and package assembly are briefly described. An automotive standard tactile module (ASTM) switch is key to the design. Design considerations even included colour of cover trim-plates and serviceability of indicator lamps.


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    Titel :

    Automotive package size driven by market demand


    Weitere Titelangaben:

    Packungsgröße in der Automobilelektronik wird durch die Marktnachfrage bestimmt


    Beteiligte:
    Mellinger, E.M. (Autor:in) / Yuska, P. (Autor:in)

    Erschienen in:

    Erscheinungsdatum :

    1990


    Format / Umfang :

    4 Seiten



    Medientyp :

    Aufsatz (Zeitschrift)


    Format :

    Print


    Sprache :

    Englisch




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