High performance multichip module (MCM) technologies were initially developed for high performance electronics for harsh military environments or for mainframe computer systems. MCM technologies involve high density packaging of multiple bare chips within a carrier, utilizing wafer fabrication processes, materials, equipment and clean rooms rather than multilayer board or hybrid technologies. With the exception of a few large vertically integrated companies such as IBM and AT&T, the MCM industry is still in the development stage lacking standards and infra-structure and generally in a low volume, high cost mode. Costs will come down as the MCM suppliers begin to evolve their processes and as volume edges higher. The application of multichip technology into the high volume and more cost sensitive markets has been limited by the high cost of MCMs and the low technical requirements of these markets. The automotive electronics industry has been on and will continue on a trend toward higher electronics content per vehicle and away from multiple electronic modules to a central multifunctional module. This trend opens the door for MCM technologies to move into automotive applications depending upon the degree to which the current approaches can reduce cost and eliminated unnecessary features. This paper will describe the evolution underway in the automotive electronics industry, will define the environmental requirements for automotive electronics and will detail the development of the non-hermetic embedded chip MCM technology. Examples of these structures will be detailed and test results on the performance of this technology in harsh environments such as automotive electronics will be shown.


    Zugriff

    Zugriff über TIB

    Verfügbarkeit in meiner Bibliothek prüfen

    Bestellung bei Subito €


    Exportieren, teilen und zitieren



    Titel :

    Non-hermetic embedded MCM technologies for automotive and other lower cost applications


    Weitere Titelangaben:

    MCM-Technologien mit nicht-hermetischen Chipkapselungen für Automobil- und weitere Niedrigpreisanwendungen


    Beteiligte:
    Fillion, R. (Autor:in) / Wojnarowski, R. (Autor:in)


    Erscheinungsdatum :

    1993


    Format / Umfang :

    8 Seiten, 6 Bilder, 2 Tabellen, 11 Quellen



    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch






    Advanced Virtualization Technologies in Aerospace and Automotive Embedded System Applications

    Stevens, K. / Siegfried, T. / Society of Automotive Engineers | British Library Conference Proceedings | 2007