A review of corrosion mechanisms in integrated electronics is presented. For metallization corrosion to occur, moisture and impurities such as Na, K or Cl must be present to form an electrolytic cell. The aluminum metallization of Integrated Circuits must be protected from the environment to prevent corrosion from occurring. Thick Film Hybrid circuits, besides being susceptable to IC corrosion mechanisms, also can fail due to dendrite formation causing shorting between gold or silver conductors that are exposed to moisture and halogen impurities. (wassmann)


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    Titel :

    Corrosion in integrated electronics


    Weitere Titelangaben:

    Korrosion in integrierter Elektronik


    Beteiligte:
    Greenstein, E. (Autor:in)


    Erscheinungsdatum :

    1978


    Format / Umfang :

    4 Seiten, 5 Bilder, 1 Tabelle, 7 Quellen


    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




    Corrosion in Integrated Electronics

    Greenstein, Eugene | SAE Technical Papers | 1978


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