Synonyme wurden verwendet für:
encapsulation
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keywords:(encapsulation)
Non-hermetic embedded MCM technologies for automotive and other lower cost applications
Maximizing lumen output of LEDs for automotive exterior signal lighting applications
Reduction in size and weight of electronic modules through the evolution of packaging design
An improved, linear homopolar, electromagnetic launcher: STAR
High density packaging for automotive applications
Millimeterwellen-Mikrosysteme für Kraftfahrzeug und Verkehrsleittechnik
Novel component packaging for high current applications using power semiconductor devices
Assessment of high-heat-flux thermal management schemes
Test method for availability of holes in height - temperature barrier on cementation process
Multilayer alumina substrates for ECU (automotive electronics)
Packaging considerations of an integrated inverter module (IIM) for hybrid vehicles
Thermal management for high performance computing in spaceborne applications
Thermal characterization of a mercury arc lamp for a projection display system
High efficiency, high reliability 2 kW inverter for aeronautical application
A study of chip top delamination in plastic encapsulated packages under temperature loading
Design limitations of powertrain electronics - automotive EMC challenges
A Novel Technology for Thermal Control for ISP module for Space Applications
Variable emissivity through MEMS technology
Memory chip packaging-an enabling technology for high-performance recce systems
New method for electrothermal simulations: HDTMOS in automotive applications
Initial performance of advanced designs for IPV nickel-hydrogen cells
Totally enclosed heat pipe cooled induction motor (theoretical and experimental results)
Performance of new silicone adhesives and encapsulants at high and low temperatures
Future developments on submarine cables and systems
High temperature, high power density packaging for automotive applications
Reliability assessment of molded Smart Power Modules
Novel composites for space microelectronics and optics
Acceleration threshold switches from an additive electroplating MEMS process
New techniques and thermoplastics for encapsulating automotive sensors and solenoids
Submarine telecommunications systems, int. Conf.; Febr. 26-29, 1980, London, GB (Part.3)
Model for BGA and CSP reliability in automotive underhood applications