Synonyme wurden verwendet für: encapsulation
Suche ohne Synonyme: keywords:(encapsulation)

1–50 von 63 Ergebnissen
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    A Smart Reconfigurable Multi-sensor Multi-filter Navigation Engine with Modular Architecture Design for Plug-and-Play Navigation

    Atia, M.M. / Givigi, S. / Noureldin, A. et al. | Tema Archiv | 2014
    Schlagwörter: Einkapselung

    Non-hermetic embedded MCM technologies for automotive and other lower cost applications

    Fillion, R. / Wojnarowski, R. | Tema Archiv | 1993
    Schlagwörter: Kapselung , nichthermetische Kapselung

    Powertrain co-simulation on top of standards

    Störmer, Christoph / Malz, Christoph / Mitrohin, Corina et al. | Tema Archiv | 2013
    Schlagwörter: Einkapselung

    Maximizing lumen output of LEDs for automotive exterior signal lighting applications

    Conn, L.G. | Tema Archiv | 2003
    Schlagwörter: Wärmehaushalt (Kapselung)

    Thermal control systems for pod-mounted avionics

    Swain, E.F. / Letton, G.C. jun. | Tema Archiv | 1979
    Schlagwörter: VERKAPSELN

    Reduction in size and weight of electronic modules through the evolution of packaging design

    Bergamaschi, G. / Bettini, R. | Tema Archiv | 1997
    Schlagwörter: Kapselung

    An improved, linear homopolar, electromagnetic launcher: STAR

    Nunnally, W.C. / Thompson, J.E. / Engel, T.G. et al. | Tema Archiv | 2004
    Schlagwörter: Wärmehaushalt (Kapselung)

    High density packaging for automotive applications

    Sommer, J.P. / Michel, B. / Hofmann, Th et al. | Tema Archiv | 2011
    Schlagwörter: Chip-Größen-Kapselung

    Millimeterwellen-Mikrosysteme für Kraftfahrzeug und Verkehrsleittechnik

    Hager, W. / Schroth, J. / Meinel, H. | Tema Archiv | 1996
    Schlagwörter: Kapselung

    Novel component packaging for high current applications using power semiconductor devices

    Weigeber, Volker / Hayes, Montry B. / Campbell, Robert J. et al. | Tema Archiv | 2009
    Schlagwörter: verbesserte Einkapselung

    Assessment of high-heat-flux thermal management schemes

    Mudawar, I. | Tema Archiv | 2000
    Schlagwörter: Wärmehaushalt (Kapselung)

    Test method for availability of holes in height - temperature barrier on cementation process

    Valentin Tcenev, I. / Fillipov, F. | Tema Archiv | 2007
    Schlagwörter: Wärmehaushalt (Kapselung)

    Multilayer alumina substrates for ECU (automotive electronics)

    Sugai, K. / Matsumoto, H. / Shimojyou, Y. et al. | Tema Archiv | 1998
    Schlagwörter: keramische Kapselung , Wärmehaushalt (Kapselung)

    Packaging considerations of an integrated inverter module (IIM) for hybrid vehicles

    Beckedahl, P. / Tursky, W. / Scheuermann, U. | Tema Archiv | 2005
    Schlagwörter: Verkapseln

    Pre-development validation of an engine mounted encapsulation approach on SUV vehicle as 'Eco-Innovation' by means of EU Regulation 725/2011

    Petley, D. / Jansen, W. / Wicksteed, B. et al. | Tema Archiv | 2013
    Schlagwörter: Einkapselung

    Reliability of commercial plastic encapsulated microelectronics at temperatures from 125 degrees C to 300 degrees C

    McCluskey, P. / Mensah, K. / O'Connor, C. et al. | Tema Archiv | 2000
    Schlagwörter: Wärmehaushalt (Kapselung)

    Automotive electronics IC reliability

    Straub, R.J. | Tema Archiv | 1990
    Schlagwörter: KAPSELUNG

    Thermal management for high performance computing in spaceborne applications

    Samson, J.R. jun. / Cutting, F.M. | Tema Archiv | 2000
    Schlagwörter: Wärmehaushalt (Kapselung)

    Thermal characterization of a mercury arc lamp for a projection display system

    Bush, B. / Li, Shu / Kelley, D. | Tema Archiv | 2004
    Schlagwörter: Wärmehaushalt (Kapselung)

    Thermal modeling of secondary lithium batteries for electric vehicle/hybrid electric vehicle applications

    Al-Hallaj, S. / Selman, J.R. | Tema Archiv | 2002
    Schlagwörter: Wärmehaushalt (Kapselung)

    High efficiency, high reliability 2 kW inverter for aeronautical application

    Vieillard, S. / Meuret, R. | Tema Archiv | 2007
    Schlagwörter: Wärmehaushalt (Kapselung)

    A study of chip top delamination in plastic encapsulated packages under temperature loading

    Kravchenko, G. / Bohm, C. | Tema Archiv | 2007
    Schlagwörter: Verkapseln

    Design limitations of powertrain electronics - automotive EMC challenges

    Kuvedu-Libla, J.R.K. | Tema Archiv | 2009
    Schlagwörter: Wärmehaushalt (Kapselung)

    Silicon sensors for automotive applications

    Rouet, J.P. / Grandjean, G. | Tema Archiv | 1993
    Schlagwörter: Kapselung

    A Novel Technology for Thermal Control for ISP module for Space Applications

    Monti, Riccardo / Barboni, Renato / Gasbarri, Paolo et al. | Tema Archiv | 2010
    Schlagwörter: Wärmehaushalt (Kapselung)

    Variable emissivity through MEMS technology

    Garrison Darrin, A. / Osiander, R. / Champion, J. et al. | Tema Archiv | 2000
    Schlagwörter: Wärmehaushalt (Kapselung)

    Memory chip packaging-an enabling technology for high-performance recce systems

    Kaufman, B. | Tema Archiv | 1999
    Schlagwörter: Chip-on-board-Kapselung

    New method for electrothermal simulations: HDTMOS in automotive applications

    Tounsi, P. / Dorkel, J.M. / Dupuy, P. et al. | Tema Archiv | 2004
    Schlagwörter: Wärmehaushalt (Kapselung)

    Initial performance of advanced designs for IPV nickel-hydrogen cells

    Smithrick, J.J. | Tema Archiv | 1985
    Schlagwörter: DRUCKFESTE KAPSELUNG

    Optimierung des Strömungsgeräusches von PKW-Generatoren. Ein Beitrag zur Senkung der Schallemission des Antriebsaggregates

    Lutz, H.J. / Bürger, K.G. / Hackett, D. et al. | Tema Archiv | 1995
    Schlagwörter: Verkapseln

    Corrosion in integrated electronics

    Greenstein, E. | Tema Archiv | 1978
    Schlagwörter: KAPSELUNG

    Totally enclosed heat pipe cooled induction motor (theoretical and experimental results)

    Sattler, P.K. / Thoren, F. | Tema Archiv | 1984
    Schlagwörter: DRUCKFESTE KAPSELUNG

    Improved specific energy Ni-H2 cell

    Miller, L.E. | Tema Archiv | 1985
    Schlagwörter: DRUCKFESTE KAPSELUNG

    Design of hardened radar structures

    Mann, R.L. | Tema Archiv | 1977
    Schlagwörter: KAPSELUNG

    Performance of new silicone adhesives and encapsulants at high and low temperatures

    Mollie, J.P. / Paquet, R.L. | Tema Archiv | 1991
    Schlagwörter: KAPSELUNG

    Future developments on submarine cables and systems

    Reinaudo, C. / Libert, J.F. | Tema Archiv | 1994
    Schlagwörter: druckfeste Kapselung

    A case history in power generation

    Ley, D.E. | Tema Archiv | 1985
    Schlagwörter: KAPSELUNG

    An 8-Bit 2-gigasample/second A/D converter multichip module for digital receiver demonstration on Navy AN/APS-145 E2-C Airborne Early Warning Aircraft radar

    Thompson, R.L. / Degerstrom, M.J. / Walters, W.L. et al. | Tema Archiv | 1998
    Schlagwörter: Wärmehaushalt (Kapselung)

    High temperature, high power density packaging for automotive applications

    Gerber, M. / Ferreira, J.A. / Hofsajer, I.W. et al. | Tema Archiv | 2003
    Schlagwörter: Wärmehaushalt (Kapselung)

    Capping technologies for MEMS

    Hausnear, R. / Stahl, H. | Tema Archiv | 2010
    Schlagwörter: Einkapselung

    Reliability assessment of molded Smart Power Modules

    Thomas, Tina / Becker, Karl-Friedrich / Dijk, Marius van et al. | Tema Archiv | 2014
    Schlagwörter: Einkapselung

    Novel composites for space microelectronics and optics

    Kowbel, W. / Champion, W. / Oliver, P. et al. | Tema Archiv | 2001
    Schlagwörter: Wärmehaushalt (Kapselung)

    Incendivity of electrical sparking due to circulating currents in the enclosures of large electrical machines

    Bartels, A.L. / Bradford, M. / Thompson, M.G. | Tema Archiv | 1988
    Schlagwörter: DRUCKFESTE KAPSELUNG

    Acceleration threshold switches from an additive electroplating MEMS process

    Michaelis, S. / Timme, H.J. / Wycisk, M. et al. | Tema Archiv | 2000
    Schlagwörter: Chip-Größen-Kapselung

    New techniques and thermoplastics for encapsulating automotive sensors and solenoids

    Al-Aseer, M.A. / Neal, G.D. / Patterson, J.F. et al. | Tema Archiv | 1993
    Schlagwörter: Kapselung

    Flip chip technology for multi chip modules

    Jung, E. / Aschenbrenner, R. / Busse, E. et al. | Tema Archiv | 1997
    Schlagwörter: keramische Kapselung

    Model for BGA and CSP reliability in automotive underhood applications

    Lall, P. / Islam, N. / Suhling, J. | Tema Archiv | 2003
    Schlagwörter: Chip-Größen-Kapselung