In the past years, the contents of electronics in a car has dramatically grown. A lot of purely mechanical functions has shifted to electronically controlled systems; moreover, electronics offered new possibilities for new functions. The reduction in size and weight has become one of the hardest challenges for ECU's (Electronics Control Unit) packaging designers because of increasing complexity, harsher environments, increasing power to be heatsunk, part cost and assembly cost reduction, and higher quality goals. This is emphasized in small cars applications. The evolutions of packaging technologies in such fields are described as substrates, interconnections, power management, materials and assembly techniques that drive the constant size reduction trends in ECU's.


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    Titel :

    Reduction in size and weight of electronic modules through the evolution of packaging design


    Weitere Titelangaben:

    Bauteilreduktion durch eine verbesserte Halbleitergehäusetechnik und deren Wirkung auf die Fahrzeugelektrik


    Beteiligte:
    Bergamaschi, G. (Autor:in) / Bettini, R. (Autor:in)


    Erscheinungsdatum :

    1997


    Format / Umfang :

    7 Seiten, 4 Bilder


    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




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