The automotive industry is pushing power electronic packaging to higher operating and heatsink temperatures while still requiring very high power densities due to limited space. Currently, the power electronics that is implemented within the engine compartment of the vehicle must operate with heatsink temperatures of approximately 85 degrees C and this temperature can be expected to increase to 125 degrees C in the near future. The high temperature operation of the power electronic structure is fundamentally limited by the employed materials maximum temperatures. A packaging concept is introduced that describes a structure realisation that enables the materials to operate at high ambient temperatures without exceeding their individual maximum temperatures. This in turn allows the complete power electronic structure to operate at a higher system temperature. In this paper, the packaging concept that can be used to meet these difficult requirements of high temperature and high power-density is introduced, discussed and implemented. Two case studies are considered and implemented to illustrate the packaging concept.


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    Titel :

    High temperature, high power density packaging for automotive applications


    Beteiligte:
    Gerber, M. (Autor:in) / Ferreira, J.A. (Autor:in) / Hofsajer, I.W. (Autor:in) / Seliger, N. (Autor:in)


    Erscheinungsdatum :

    2003


    Format / Umfang :

    6 Seiten, 9 Quellen




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




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