New generations of ECU modules (engine management unit) for mechatronics environments involve mixing technologies of SoC (system on chip) fabrication which seems a valid approach compared to design partitioned into multiple devices. High power dissipation (above 5 W), high operating temperatures (above 150 deg C) and medium to high numbers of I/Os (64 to 100) now pose a challenge for packaging design devoted to automotive applications. When SoC integrates more and more power functions, the junction temperature increases to the limits of 150 deg C that is the standard peak temperature allowed to plastic packaging for ICs. This paper describes the failure mechanism associated to high currents and high temperatures in plastic packages and shows how STM approached the above topics in designing HiQUAD-92, a new power surface mount package, specifically designed to meet the automotive market requirements in terms of high level of integration, power dissipation and high temperature reliability (up to 180 deg C).
High pin count power package for high current, high temperature automotive applications
2003
23 Seiten, 15 Bilder
Aufsatz (Konferenz)
Englisch
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