This paper describes circuit models for characterizing the thermal and dynamic behavior of printed circuit boards. The thermal model simulates the transient temperature distribution resulting from dissipative components and conductive, convective, and radiative boundaries. The dynamic model predicts the fundamental frequency for clamped edges. Both models are based on finite difference equations and confirmed by traditional methods.


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    Titel :

    SPICE Models for Thermal and Vibration Analysis of Printed Circuit Boards


    Weitere Titelangaben:

    Sae Technical Papers


    Beteiligte:
    Yip, Gary (Autor:in) / Chen, Jesse E. (Autor:in)

    Kongress:

    27th Intersociety Energy Conversion Engineering Conference (1992) ; 1992



    Erscheinungsdatum :

    03.08.1992




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch


    Schlagwörter :


    Forced Response and Random Vibration Analysis of Printed Circuit Boards

    Tarter, J. F. | British Library Online Contents | 2000


    Thermal Wake Effects in Printed Circuit Boards

    Culham, J. R. / Teertstra, P. / Yovanovich, M. M. et al. | British Library Conference Proceedings | 1998


    Thermal Analysis of Components and Traces on Printed Circuit Boards

    Rajasekharan, Jayakrishnan / ML, Sankar. T / Prasad, Suryanarayana | SAE Technical Papers | 2024


    POLYIMIDE PRINTED CIRCUIT BOARDS

    SAE Technical Papers | 1979


    New circuit boards beat heat and vibration

    Teschler,L. / Singer,US | Kraftfahrwesen | 1979