This document describes the materials, equipment, and processing techniques utilized in the fabrication of polyimide printed wiring boards. Included are recommendations for both double-sided and multi-layer boards.
POLYIMIDE PRINTED CIRCUIT BOARDS
01.10.1979
Aufsatz (Konferenz)
Englisch
Polyimide Printed Circuit Boards Fabrication of
SAE Technical Papers | 2022
Optical Links for Printed Circuit Boards
British Library Conference Proceedings | 2003
|Optical links for printed circuit boards
IEEE | 2003
|