This document describes the materials, equipment, and processing techniques utilized in the fabrication of polyimide printed wiring boards. Included are recommendations for both double-sided and multilayer boards. ARP1612A has been reaffirmed to comply with the SAE Five-Year Review policy.
Polyimide Printed Circuit Boards Fabrication of
05.06.2022
Aufsatz (Konferenz)
Englisch
POLYIMIDE PRINTED CIRCUIT BOARDS
SAE | 1979
Optical links for printed circuit boards
IEEE | 2003
|British Library Online Contents | 2013
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