This document describes the materials, equipment, and processing techniques utilized in the fabrication of polyimide printed wiring boards. Included are recommendations for both double-sided and multilayer boards. ARP1612A has been reaffirmed to comply with the SAE Five-Year Review policy.


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    Titel :

    Polyimide Printed Circuit Boards Fabrication of


    Erscheinungsdatum :

    05.06.2022



    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




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