This document describes the materials, equipment, and processing techniques utilized in the fabrication of polyimide printed wiring boards. Included are recommendations for both double-sided and multilayer boards. ARP1612A has been reaffirmed to comply with the SAE Five-Year Review policy.


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    Title :

    Polyimide Printed Circuit Boards Fabrication of


    Publication date :

    2022-06-05



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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