This document describes the materials, equipment, and processing techniques utilized in the fabrication of polyimide printed wiring boards. Included are recommendations for both double-sided and multilayer boards. ARP1612A has been reaffirmed to comply with the SAE Five-Year Review policy.
Polyimide Printed Circuit Boards Fabrication of
2022-06-05
Conference paper
English
POLYIMIDE PRINTED CIRCUIT BOARDS
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