This paper describes circuit models for characterizing the thermal and dynamic behavior of printed circuit boards. The thermal model simulates the transient temperature distribution resulting from dissipative components and conductive, convective, and radiative boundaries. The dynamic model predicts the fundamental frequency for clamped edges. Both models are based on finite difference equations and confirmed by traditional methods.


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    Title :

    SPICE Models for Thermal and Vibration Analysis of Printed Circuit Boards


    Additional title:

    Sae Technical Papers


    Contributors:
    Yip, Gary (author) / Chen, Jesse E. (author)

    Conference:

    27th Intersociety Energy Conversion Engineering Conference (1992) ; 1992



    Publication date :

    1992-08-03




    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English





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