Synonyms were used for: encapsulation
Search without synonyms: keywords:(encapsulation)

201–250 of 265 hits
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    Novel composites for space microelectronics and optics

    Kowbel, W. / Champion, W. / Oliver, P. et al. | Tema Archive | 2001
    Keywords: Wärmehaushalt (Kapselung)

    Incendivity of electrical sparking due to circulating currents in the enclosures of large electrical machines

    Bartels, A.L. / Bradford, M. / Thompson, M.G. | Tema Archive | 1988
    Keywords: DRUCKFESTE KAPSELUNG

    Siedekuehlung fuer Fahrzeugstromrichter

    Wiegner, G. | Tema Archive | 1985
    Keywords: DRUCKFESTE KAPSELUNG

    Die temperaturgesteuerte Vollkapsel des BMW 525tds

    Albenberger, J. / Steinmayr, T. / Wichtl, R. | Tema Archive | 1992
    Keywords: VERKAPSELN

    Geraeuschkapseln fuer Personenkraftwagen - Konzepte und Erfahrungen

    Haerting, W. / Hartwig, H. | Tema Archive | 1983
    Keywords: VERKAPSELN

    Improved Therapy of Experimental Leishmaniasis by Use of a Liposome-Encapsulated Antimonial Drug

    C. R. Alving / E. A. Steck / W. L. Hanson et al. | NTIS | 1978
    Keywords: Encapsulation

    Akustik- und Schwingungskomfort des neuen BMW 5er

    Thoma, G. / Bersiner, F. | Tema Archive | 2003
    Keywords: Kapselung

    Simulation of modular mechatronic systems with application to vehicle dynamics

    Rükgauer, A. / Schiehlen, W. | Tema Archive | 1997
    Keywords: Verkapseln

    Acceleration threshold switches from an additive electroplating MEMS process

    Michaelis, S. / Timme, H.J. / Wycisk, M. et al. | Tema Archive | 2000
    Keywords: Chip-Größen-Kapselung

    Lärmminderungsmaßnahmen in einem Großpreßwerk. Simulation erlaubt Vorhersagen

    Hoff, W. / Muhr, D. | Tema Archive | 1990
    Keywords: VERKAPSELN

    New techniques and thermoplastics for encapsulating automotive sensors and solenoids

    Al-Aseer, M.A. / Neal, G.D. / Patterson, J.F. et al. | Tema Archive | 1993
    Keywords: Kapselung

    Aerospace packaging defeats hostile environments

    Markstein, H.W. | Tema Archive | 1988
    Keywords: KAPSELUNG

    Qualification of a spin apply, photodefinable polymer for packaging of automotive circuits

    Wyant, J.L. / Schuckert, C.C. | Tema Archive | 2000
    Keywords: Flip-Chip-Verkapselung

    Flip chip technology for multi chip modules

    Jung, E. / Aschenbrenner, R. / Busse, E. et al. | Tema Archive | 1997
    Keywords: keramische Kapselung

    Evaluation Polyurethane Elastomeric Compound Uralane 5712, Type III

    R. H. Flack | NTIS | 1966
    Keywords: Encapsulation

    Evaluation Polyurethane Elastomeric Compound Cps-796-65, Type II

    R. H. Flack | NTIS | 1966
    Keywords: Encapsulation

    Erste Lasergroßanlage auf der Werft

    Sepold, G. / Heidenreich, B. / Binroth, C. | Tema Archive | 1992
    Keywords: VERKAPSELN

    Der Einsatz explosionsgeschuetzter Betriebsmittel in der Erdgasaufbereitung

    Gnauk, W. | Tema Archive | 1978
    Keywords: DRUCKFESTE KAPSELUNG

    Underwater Locator Beacon Detection Ranges for Fuselage Encapsulated Recorders

    R. B. Fisher / P. M. Rich | NTIS | 1968
    Keywords: Encapsulation

    Model for BGA and CSP reliability in automotive underhood applications

    Lall, P. / Islam, N. / Suhling, J. | Tema Archive | 2003
    Keywords: Chip-Größen-Kapselung

    MECON - eine neuartige Hochspannungs-Steckverbindung für Unterwasser-Anwendungen

    Ostergaard, I. / Sande, G. / Nysveen, A. et al. | Tema Archive | 1999
    Keywords: Kapselung

    Encapsulation, Electronics, Eccofoam

    F. N. Le Doux | NTIS | 1965
    Keywords: Encapsulation

    Optimal sizing of powder handling horizontal capsule pipelines

    Agarwal, V.C. / Rakesh Mishra | Tema Archive | 1998
    Keywords: Verkapseln

    Design and characteristics of submarine optical fiber cable

    Ishihara, K. / Kawata, O. / Yoshizawa, N. | Tema Archive | 1985
    Keywords: DRUCKFESTE KAPSELUNG

    PV degradation curves: non‐linearities and failure modes

    Jordan, Dirk C | Online Contents | 2017
    Keywords: Encapsulation

    Structural Design of Pavements for Light Aircraft

    D. M. Ladd / F. Parker / A. T. Pereira | NTIS | 1976
    Keywords: Encapsulation

    Lead free alloys for flip chip bumping

    Jung, E. / Aschenbrenner, R. / Kallmayer, C. et al. | Tema Archive | 2001
    Keywords: Chip-Größen-Kapselung

    300 ampere, 1000 volt hermetic Darlington transistor

    Morozowich, M. | Tema Archive | 1989
    Keywords: DRUCKFESTE KAPSELUNG

    Comparison of mechanical reliability of three underfill materials for flip chip bumps on high Tg PCB for automotive applications

    Fabbri, G. / Sartori, C. / Scarano, G. | Tema Archive | 2001
    Keywords: Chip-on-board-Kapselung

    Automotive package size driven by market demand

    Mellinger, E.M. / Yuska, P. | Tema Archive | 1990
    Keywords: KAPSELUNG

    Accelerated testing of flip chip packages under dynamic load

    Rau, I. / Miessner, R. / Liebing, G. et al. | Tema Archive | 2001
    Keywords: Flip-Chip-Verkapselung

    Integrated Power Amplifier Final Report, Mar. 1964 - Sep. 1965

    T. C. New | NTIS | 1965
    Keywords: Encapsulation

    Alvin-120 VDC/28 VDC electrical system

    Hosom, D.S. / Forrester, N.C. / Walden, B.B. | Tema Archive | 1987
    Keywords: KAPSELUNG

    Packaging military and commercial electronics

    Markstein, H.W. | Tema Archive | 1987
    Keywords: KAPSELUNG

    Submarine Horizontal Launch TACTOM Capsule

    J. C. Callahan | NTIS | 2001
    Keywords: Encapsulation

    Direct glassing of silicon space solar cells: approach and manufacturing experiences

    Koch, J.W. / White, P.A. | Tema Archive | 1990
    Keywords: KAPSELUNG

    Enabling technologies for integrated system-on-a-package for the next generation aerospace applications

    Young, J.J. / Malshe, A.P. / Brown, W.D. et al. | Tema Archive | 2002
    Keywords: Wärmehaushalt (Kapselung)

    Thermal management of military fighter aircraft electro-optics pod: an invited paper

    Price, D.C. | Tema Archive | 2003
    Keywords: Wärmehaushalt (Kapselung)

    Warm Fog Modification Studies

    T. B. Smith | NTIS | 1971
    Keywords: Encapsulation

    3-layered 3D flex based MCM: electrical characterization and reliability issues

    Morrison, W.B. / Railkar, T.A. / Malshe, A.P. et al. | Tema Archive | 1999
    Keywords: Wärmehaushalt (Kapselung)

    Decontamination of the Aimp-D Spacecraft

    F. N. Le Doux | NTIS | 1967
    Keywords: Encapsulation

    Trial of Noise-Reduced Diesel-Powered Vehicles in Practical Use. Final Report

    W. Haerting / W. Voehringer / G. Horn et al. | NTIS | 1985
    Keywords: Encapsulation