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encapsulation
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Predicting, categorizing and intercomparing the lifetime of OPVs for different ageing tests
Gehäusekonzepte für Leistungs-MOSFETs und Schottky-Dioden
Heat transfer and thermal management of electric vehicle batteries with phase change materials
High density packaging for automotive applications
A Novel Technology for Thermal Control for ISP module for Space Applications
Design limitations of powertrain electronics - automotive EMC challenges
Test method for availability of holes in height - temperature barrier on cementation process
A study of chip top delamination in plastic encapsulated packages under temperature loading
High efficiency, high reliability 2 kW inverter for aeronautical application
Metal-enclosed, air-insulated traction switchgear - developments and applications
Reliability potential of epoxy based encapsulants for automotive applications
Packaging considerations of an integrated inverter module (IIM) for hybrid vehicles