Synonyms were used for: encapsulation
Search without synonyms: keywords:(encapsulation)

51–100 of 122 hits
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    Design limitations of powertrain electronics - automotive EMC challenges

    Kuvedu-Libla, J.R.K. | Tema Archive | 2009
    Keywords: Wärmehaushalt (Kapselung)

    Silicon sensors for automotive applications

    Rouet, J.P. / Grandjean, G. | Tema Archive | 1993
    Keywords: Kapselung

    A Novel Technology for Thermal Control for ISP module for Space Applications

    Monti, Riccardo / Barboni, Renato / Gasbarri, Paolo et al. | Tema Archive | 2010
    Keywords: Wärmehaushalt (Kapselung)

    Selecting enclosures for offshore usage

    Deavin, I. | Tema Archive | 1984
    Keywords: KAPSELUNG

    Optimized cooling systems for high-power semiconductor devices

    Baumann, H. / Heinemeyer, P. / Staiger, W. et al. | Tema Archive | 2001
    Keywords: Wärmehaushalt (Kapselung)

    Variable emissivity through MEMS technology

    Garrison Darrin, A. / Osiander, R. / Champion, J. et al. | Tema Archive | 2000
    Keywords: Wärmehaushalt (Kapselung)

    Memory chip packaging-an enabling technology for high-performance recce systems

    Kaufman, B. | Tema Archive | 1999
    Keywords: Chip-on-board-Kapselung

    Initial performance of advanced designs for IPV nickel-hydrogen cells

    Smithrick, J.J. | Tema Archive | 1985
    Keywords: DRUCKFESTE KAPSELUNG

    New method to determine the range of DVB-H networks and the influence of MPE-FEC rate and modulation scheme

    Plets, David / Joseph, Wout / Verloock, Leen et al. | Tema Archive | 2009
    Keywords: MPE (multiprotocol encapsulation)

    New method for electrothermal simulations: HDTMOS in automotive applications

    Tounsi, P. / Dorkel, J.M. / Dupuy, P. et al. | Tema Archive | 2004
    Keywords: Wärmehaushalt (Kapselung)

    Prediction of thermal performance of wire-bonded plastic ball grid array package for underhood automotive applications

    Ramakrishna, K. / Trent, J.R. | Tema Archive | 2003
    Keywords: Wärmehaushalt (Kapselung)

    Optimierung des Strömungsgeräusches von PKW-Generatoren. Ein Beitrag zur Senkung der Schallemission des Antriebsaggregates

    Lutz, H.J. / Bürger, K.G. / Hackett, D. et al. | Tema Archive | 1995
    Keywords: Verkapseln

    Plastic encapsulated components for cars

    Hanreich, G. / Nicolics, J. / Musiejovsky, L. | Tema Archive | 2001
    Keywords: Wärmehaushalt (Kapselung)

    Aufwendiges Tuning für den Ex-Schutz. Flurförderzeuge

    Tema Archive | 1996
    Keywords: Kapselung

    Corrosion in integrated electronics

    Greenstein, E. | Tema Archive | 1978
    Keywords: KAPSELUNG

    Totally enclosed heat pipe cooled induction motor (theoretical and experimental results)

    Sattler, P.K. / Thoren, F. | Tema Archive | 1984
    Keywords: DRUCKFESTE KAPSELUNG

    Heavy-ion single-event effects testing of lead-on-chip assembled high-density memories

    Harboe-Sorensen, R. / Guerre, F.X. / Loquet, J.G. et al. | Tema Archive | 2003
    Keywords: Chip-Größen-Kapselung

    IP-Schutzart fuer Fahrzeug-Waschanlagen

    Nowak, K. | Tema Archive | 1983
    Keywords: KAPSELUNG

    Improved specific energy Ni-H2 cell

    Miller, L.E. | Tema Archive | 1985
    Keywords: DRUCKFESTE KAPSELUNG

    Design of hardened radar structures

    Mann, R.L. | Tema Archive | 1977
    Keywords: KAPSELUNG

    Performance of new silicone adhesives and encapsulants at high and low temperatures

    Mollie, J.P. / Paquet, R.L. | Tema Archive | 1991
    Keywords: KAPSELUNG

    An 8-Bit 2-gigasample/second A/D converter multichip module for digital receiver demonstration on Navy AN/APS-145 E2-C Airborne Early Warning Aircraft radar

    Thompson, R.L. / Degerstrom, M.J. / Walters, W.L. et al. | Tema Archive | 1998
    Keywords: Wärmehaushalt (Kapselung)

    Teure aber unverzichtbare Helfer. Explosionsgeschützte Gabelstapler

    Bachmann, O. | Tema Archive | 1997
    Keywords: Verkapseln

    Future developments on submarine cables and systems

    Reinaudo, C. / Libert, J.F. | Tema Archive | 1994
    Keywords: druckfeste Kapselung

    A case history in power generation

    Ley, D.E. | Tema Archive | 1985
    Keywords: KAPSELUNG

    The changing automotive environment: high-temperature electronics

    Johnson, R.W. / Evans, J.L. / Jacobsen, P. et al. | Tema Archive | 2004
    Keywords: Wärmehaushalt (Kapselung)

    High temperature, high power density packaging for automotive applications

    Gerber, M. / Ferreira, J.A. / Hofsajer, I.W. et al. | Tema Archive | 2003
    Keywords: Wärmehaushalt (Kapselung)

    Trockene MKK-Kondensatoren für moderne Schienenfahrzeuge

    Vetter, H. | Tema Archive | 1997
    Keywords: druckfeste Kapselung

    Capping technologies for MEMS

    Hausnear, R. / Stahl, H. | Tema Archive | 2010
    Keywords: Einkapselung

    Reliability assessment of molded Smart Power Modules

    Thomas, Tina / Becker, Karl-Friedrich / Dijk, Marius van et al. | Tema Archive | 2014
    Keywords: Einkapselung

    Siedekuehlung fuer Fahrzeugstromrichter

    Wiegner, G. | Tema Archive | 1985
    Keywords: DRUCKFESTE KAPSELUNG

    Novel composites for space microelectronics and optics

    Kowbel, W. / Champion, W. / Oliver, P. et al. | Tema Archive | 2001
    Keywords: Wärmehaushalt (Kapselung)

    Incendivity of electrical sparking due to circulating currents in the enclosures of large electrical machines

    Bartels, A.L. / Bradford, M. / Thompson, M.G. | Tema Archive | 1988
    Keywords: DRUCKFESTE KAPSELUNG

    Acceleration threshold switches from an additive electroplating MEMS process

    Michaelis, S. / Timme, H.J. / Wycisk, M. et al. | Tema Archive | 2000
    Keywords: Chip-Größen-Kapselung

    New techniques and thermoplastics for encapsulating automotive sensors and solenoids

    Al-Aseer, M.A. / Neal, G.D. / Patterson, J.F. et al. | Tema Archive | 1993
    Keywords: Kapselung

    Aerospace packaging defeats hostile environments

    Markstein, H.W. | Tema Archive | 1988
    Keywords: KAPSELUNG

    Qualification of a spin apply, photodefinable polymer for packaging of automotive circuits

    Wyant, J.L. / Schuckert, C.C. | Tema Archive | 2000
    Keywords: Flip-Chip-Verkapselung

    Flip chip technology for multi chip modules

    Jung, E. / Aschenbrenner, R. / Busse, E. et al. | Tema Archive | 1997
    Keywords: keramische Kapselung

    Der Einsatz explosionsgeschuetzter Betriebsmittel in der Erdgasaufbereitung

    Gnauk, W. | Tema Archive | 1978
    Keywords: DRUCKFESTE KAPSELUNG

    Model for BGA and CSP reliability in automotive underhood applications

    Lall, P. / Islam, N. / Suhling, J. | Tema Archive | 2003
    Keywords: Chip-Größen-Kapselung

    MECON - eine neuartige Hochspannungs-Steckverbindung für Unterwasser-Anwendungen

    Ostergaard, I. / Sande, G. / Nysveen, A. et al. | Tema Archive | 1999
    Keywords: Kapselung

    Design and characteristics of submarine optical fiber cable

    Ishihara, K. / Kawata, O. / Yoshizawa, N. | Tema Archive | 1985
    Keywords: DRUCKFESTE KAPSELUNG

    PV degradation curves: non‐linearities and failure modes

    Jordan, Dirk C | Online Contents | 2017
    Keywords: Encapsulation