A thermal analysis was performed to simulate the conduction heat transfer in the 50 mil (0.05 inch center-to-center pin spacing) leadless ceramic chip carrier. The parameter 'Rjc' (thermal resistance, junction-to-case) was determined for two mounting configurations of the LCCC on a typical circuit board and curves were developed allowing the prediction of Rjc for various LCCC constructions. The analysis was performed to clarify discrepancies in the many interpretations of Rjc existing among component manufacturers. An attempt is made to define Rjc in a manner that relates it to the mounting of the LCCC and aids in a more realistic prediction of the chip junction temperature. The findings are applicable for assessing the thermal performance of surface mount technology in packaging aerospace electronics.
Thermal analysis of the 50 mil leadless ceramic chip carrier
Thermische Analyse des bleilosen 50 Mil Chiphaltens aus Keramik
ASME-Papers ; Dec ; 1-9
1987
9 Seiten, 15 Bilder, 2 Tabellen, 16 Quellen
Conference paper
English
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