With fewer major military programs to compete for, it has become ever more important to provide low risk, cost effective system solutions. The SPPD processpr family has successfully been inserted in several DOD programs because of its flexibility from both an architectural and a packaging point of view. The multiprocessor Digital Signal Processor architecture is based on high performance, off-the-shelf components. The components and the design as a whole are supported by extensive software development tools, and they are also supported by solid design evolution plans. High density MultiChip Module versions of these processors have been successfully designed, fabricated, and delivered to multiple DOD customers. Flight and hover tests of the SPPD signal processor and the ESPPD signal processor are scheduled for mid-1993.


    Access

    Access via TIB

    Check availability in my library

    Order at Subito €


    Export, share and cite



    Title :

    Developing MultiChip modules for a rapidly changing military technology market


    Additional title:

    Entwurf von Multichip-Schaltungen für einen sich schnell verändernden Markt an Militärelektronik


    Contributors:
    Scannel, R.K. (author) / Spear, J.D. (author)


    Publication date :

    1993


    Size :

    6 Seiten, 1 Bild, 4 Tabellen



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English





    Co-fired ceramic on metal multichip modules for advanced military packaging

    Prabhu, A.N. / Cherukuri, S.C. / Thaler, B.J. et al. | IEEE | 1993


    Multichip modules for automotive applications

    Simsek, A. / Strohschein, W. / Reichl, H. | Tema Archive | 1999


    Multichip modules for today's VLSI circuits

    Moravec, T.J. / Jensen, R.J. / Coogan, S.A. et al. | Tema Archive | 1990


    Optical interconnects for multichip modules [2216-09]

    Haas, F. / Honey, D. A. / SPIE | British Library Conference Proceedings | 1994