Thin-film, multilayer interconnect technology achieves both high density and high speed. The new Honeywell MCM interconnect technology is based on thin film techniques and IC process equipment. This thin film multilayer (TFML) technology for interconnecting substrates was demonstrated in 1984. Since then, over 20 companies have implemented, to varying degrees, some form of thin film interconnects for MCMs containing high I/O, high speed VLSI ICs. It is easy to see why; knowledge and equipment for IC processing are widespread. One advantage of the TFML process is that it can be implemented on a wide variety of substrates, including ceramics (multilayer cofired or tape cast), metals and silicon wafers. The most important application for MCMs at Honeywell is for spaceborn computer and radiation tolerant electronics applications. An example is a central processing unit called the Honeywell Generic VHSIC Spaceborne Computer (GVSC). The GVSC is a radiation-hardened 1750A computer, originally housed in five single chip packages with 256 leads each. The GVSC chip set was implemented in a 2*2 in. MCM with 200 leads on a 0.035 in. pitch. The substrate/chip assembly is hermetically sealed in a kovar package. The article shows a comparison between the single chip and multichip versions of the GVSC.
Multichip modules for today's VLSI circuits
Multichipmodule für heutige VLSI-Schaltungen
Electronic Packaging and Production ; 30 , 11 ; 48-53
1990
6 Seiten, 3 Quellen
Article (Journal)
English
HYBRIDSCHALTUNG , DUENNSCHICHTSCHALTUNG , KERAMIK , ZENTRALEINHEIT (RECHNER) , VLSI-SCHALTUNG , AVIONIK , MIKROPROZESSOR , CHIP , MODULBAUWEISE , KAPSELUNG , STRAHLUNGSFESTIGKEIT , MEHRSCHICHTSCHALTUNG , HAERTEN , MULTICHIP-SCHALTUNG , HIGH DENSITY , SI SUBSTRATES , VERPACKUNGSTECHNIK , KERAMISCHES SUBSTRAT , METALLSUBSTRAT
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