With fewer major military programs to compete for, it has become ever more important to provide low risk, cost effective system solutions. The SPPD processpr family has successfully been inserted in several DOD programs because of its flexibility from both an architectural and a packaging point of view. The multiprocessor Digital Signal Processor architecture is based on high performance, off-the-shelf components. The components and the design as a whole are supported by extensive software development tools, and they are also supported by solid design evolution plans. High density MultiChip Module versions of these processors have been successfully designed, fabricated, and delivered to multiple DOD customers. Flight and hover tests of the SPPD signal processor and the ESPPD signal processor are scheduled for mid-1993.


    Zugriff

    Zugriff über TIB

    Verfügbarkeit in meiner Bibliothek prüfen

    Bestellung bei Subito €


    Exportieren, teilen und zitieren



    Titel :

    Developing MultiChip modules for a rapidly changing military technology market


    Weitere Titelangaben:

    Entwurf von Multichip-Schaltungen für einen sich schnell verändernden Markt an Militärelektronik


    Beteiligte:
    Scannel, R.K. (Autor:in) / Spear, J.D. (Autor:in)


    Erscheinungsdatum :

    1993


    Format / Umfang :

    6 Seiten, 1 Bild, 4 Tabellen



    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch





    Multichip modules for automotive applications

    Simsek, A. / Strohschein, W. / Reichl, H. | Tema Archiv | 1999


    Multichip modules for today's VLSI circuits

    Moravec, T.J. / Jensen, R.J. / Coogan, S.A. et al. | Tema Archiv | 1990


    Optical interconnects for multichip modules [2216-09]

    Haas, F. / Honey, D. A. / SPIE | British Library Conference Proceedings | 1994


    Military multichip module packaging design and manufacture

    Cleveland, C. / Pietila, D. / Rassaian, M. et al. | Tema Archiv | 1992