The development of multichip module technology has advanced rapidly over the last decade. With packaging/interconnect becoming the dominant delay in a system, system integrator are realizing this offers an alternative solution to achieving system performance without going to leading edge silicon technology. In this paper an approach to the design and fabrication of multichip module is described. The design and fabrication of a multichip module has been described using a top down design approach which is compatible with existing CAD software. This allows the design information including ASIC simulation to be included in the multichip module design effort. First pass success was achieved for the interconnect substrate. Assemly of the substrate with silicon devices is complete.
Multichip module design and fabrication example an interconnect for a military applications
Multichip-Modulentwurf und Fertigungsbeispiel bei militärischen Anwendungen
1991
4 Seiten, 3 Bilder, 2 Tabellen, 1 Quelle
Conference paper
English
Military multichip module packaging design and manufacture
Tema Archive | 1992
|Development of multichip module packaging for the military environment
Tema Archive | 1992
|Design and Fabrication of a Tri-C30 Multichip Module Building Block
British Library Conference Proceedings | 1997
|British Library Conference Proceedings | 1997
|Tunneling Accelerometer Multichip Module
NTRS | 1998
|