The development of multichip module technology has advanced rapidly over the last decade. With packaging/interconnect becoming the dominant delay in a system, system integrator are realizing this offers an alternative solution to achieving system performance without going to leading edge silicon technology. In this paper an approach to the design and fabrication of multichip module is described. The design and fabrication of a multichip module has been described using a top down design approach which is compatible with existing CAD software. This allows the design information including ASIC simulation to be included in the multichip module design effort. First pass success was achieved for the interconnect substrate. Assemly of the substrate with silicon devices is complete.


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    Titel :

    Multichip module design and fabrication example an interconnect for a military applications


    Weitere Titelangaben:

    Multichip-Modulentwurf und Fertigungsbeispiel bei militärischen Anwendungen


    Beteiligte:
    Wells, V.A. (Autor:in)


    Erscheinungsdatum :

    1991


    Format / Umfang :

    4 Seiten, 3 Bilder, 2 Tabellen, 1 Quelle


    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




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