Advanced electronics systems require increased performance and reliability with reduced size, weight and cost. These requirements can be met by advances in semiconductor technology and by selected packaging and interconnect techniques. System packaging begins at the Integrated Circuit (IC) die level. As single chip packages become larger with higher pin counts, they require increased board space and interconnect that can inhibit system electrical performance and add to size, weight, and cost. Multichip packaging has been used for a number of years in hybrid microelectronics to provide reduced size and weight with increased performance. As the demand continues for higher performance at lower cost, improvements in microelectronics packaging are required. To that end, Multichip Modules (MCM) are being developed. A variety of MCM types are emerging for commercial and military applications. This paper provides information on the development of MCM packaging with the focus on military application.
Development of multichip module packaging for the military environment
Entwicklung von Packungsmethoden für Module mit mehreren Chips zum Einsatz im militärischen Bereich
1992
23 Seiten, 10 Bilder, 2 Tabellen, 2 Quellen
Conference paper
English
Military multichip module packaging design and manufacture
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