This paper reviews the physics-of-failure model for accelerated thermal cycle tests of solder joints associated with various electronics components, summarizes the parameters of the automotive environment, and discusses the methods for developing thermal cycle tests for reliability validation for automotive electronics. The paper proposes an approach to develop the requirements for validation tests based on the customer usage profiles and the desired product life goal. This requirement determines the nominal testing duration based on the equivalent damage generated from the worst-case field applications.


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    Title :

    Correlation of Thermal Cycle Tests to Field Usage Profiles for Solder Joints in Automotive Electronics


    Additional title:

    Sae Technical Papers


    Contributors:

    Conference:

    International Congress & Exposition ; 1998



    Publication date :

    1998-02-23




    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




    Correlation of thermal cycles tests to field usage profile for solder joints in automotive electronics

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