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    Title :

    Correlation of Thermal Cycles Tests to Field Usage Profile for Solder Joints in Automotive Electronics



    Conference:

    Session, Electronic packaging ; 1998 ; Detroit; MI


    Published in:

    Electronic packaging ; 1345 ; 25-32

    SAE SP ; 1345


    Publication date :

    1998-01-01


    Size :

    8 pages


    Remarks:

    Held as part of the SAE international congress and exposition



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




    Correlation of thermal cycles tests to field usage profile for solder joints in automotive electronics

    Hu,J.M. / Garfinkel,G.A. / Visteon Automotive Systems,US | Automotive engineering | 1998



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