Correlation of Thermal Cycles Tests to Field Usage Profile for Solder Joints in Automotive Electronics
Session, Electronic packaging ; 1998 ; Detroit; MI
1998-01-01
8 pages
Held as part of the SAE international congress and exposition
Conference paper
English
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Automotive engineering | 1998
|SAE Technical Papers | 1998
|Lead Free Solder for Automotive Electronics
SAE Technical Papers | 1998
|Lead free solder for automotive electronics
Automotive engineering | 1998
|Lead Free Solder for Automotive Electronics
British Library Conference Proceedings | 1998
|