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    Title :

    Correlation of thermal cycles tests to field usage profile for solder joints in automotive electronics


    Additional title:

    Korrelation zwischen Tests bei thermischer Wechselbelastung und dem Nutzungsprofil im Feld fuer Loetverbindungen der Kraftfahrzeugelektronik.



    Publication date :

    1998


    Size :

    8 pages


    Remarks:

    SAE-Paper;980344;1998;Electronic Packaging;SAE Spec.Publ.; SP-1345


    Type of media :

    Miscellaneous


    Type of material :

    Print


    Language :

    English



    Correlation of Thermal Cycles Tests to Field Usage Profile for Solder Joints in Automotive Electronics

    Hu, J. M. / Garfinkel, G. A. / Society of Automotive Engineers | British Library Conference Proceedings | 1998



    Lead Free Solder for Automotive Electronics

    Whitten, Gordon | SAE Technical Papers | 1998


    Lead free solder for automotive electronics

    Whitten,G. / Delphi Delco Electronics Systems,US | Automotive engineering | 1998


    Lead Free Solder for Automotive Electronics

    Whitten, G. / Society of Automotive Engineers | British Library Conference Proceedings | 1998