Correlation of thermal cycles tests to field usage profile for solder joints in automotive electronics
Korrelation zwischen Tests bei thermischer Wechselbelastung und dem Nutzungsprofil im Feld fuer Loetverbindungen der Kraftfahrzeugelektronik.
1998
8 pages
SAE-Paper;980344;1998;Electronic Packaging;SAE Spec.Publ.; SP-1345
Miscellaneous
English
| British Library Conference Proceedings | 1998
Lead Free Solder for Automotive Electronics
| British Library Conference Proceedings | 1998
Lead free solder for automotive electronics
| Automotive engineering | 1998
Lead Free Solder for Automotive Electronics
| SAE | 1998