This specification covers a single-component, unfilled, heat-reactive, thermosetting, aromatic system which thermally cures to form a polyimide polymer structure. This document has been determined to contain basic and stable technology which is not dynamic in nature.


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    Title :

    Resin, Polyimide, Sealing High-Temperature Resistant, 315 °C (600 °F) Unfilled


    Publication date :

    2016-10-13



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English