This specification covers a single-component, unfilled, heat-reactive, thermosetting, aromatic system which thermally cures to form a polyimide polymer structure. This document has been determined to contain basic and stable technology which is not dynamic in nature.
Resin, Polyimide, Sealing High-Temperature Resistant, 315 °C (600 °F) Unfilled
2016-10-13
Conference paper
English
RESIN, POLYIMIDE, SEALING High-Temperature Resistant, 315 °C (600 °F) Unfilled
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