This specification covers a single-component, unfilled, heat-reactive, thermosetting, aromatic system which thermally cures to form a polyimide polymer structure.


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    Title :

    RESIN, POLYIMIDE, SEALING High-Temperature Resistant, 315°C (600°F) Unfilled


    Publication date :

    2011-08-12



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English