This specification covers a single-component, unfilled, heat-reactive, thermosetting, aromatic system which thermally cures to form a polyimide polymer structure. This document has been determined to contain basic and stable technology which is not dynamic in nature.
Resin, Polyimide, Sealing High-Temperature Resistant, 315 °C (600 °F) Unfilled
13.10.2016
Aufsatz (Konferenz)
Englisch
RESIN, POLYIMIDE, SEALING High-Temperature Resistant, 315 °C (600 °F) Unfilled
SAE Technical Papers | 1993
RESIN, POLYIMIDE, SEALING High-Temperature Resistant, 315°C (600°F) Unfilled
SAE Technical Papers | 2011
RESIN, POLYIMIDE, SEALING High Temperature Resistant, 315°C or 600°F Unfilled
SAE Technical Papers | 1975
SAE Technical Papers | 1992
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