This specification covers a single-component, unfilled, heat-reactive, thermosetting, aromatic system which thermally cures to form a polyimide polymer structure.
RESIN, POLYIMIDE, SEALING High Temperature Resistant, 315°C or 600°F Unfilled
1975-09-01
Aufsatz (Konferenz)
Englisch
RESIN, POLYIMIDE, SEALING High-Temperature Resistant, 315 °C (600 °F) Unfilled
SAE Technical Papers | 1993
RESIN, POLYIMIDE, SEALING High-Temperature Resistant, 315°C (600°F) Unfilled
SAE Technical Papers | 2011
Resin, Polyimide, Sealing High-Temperature Resistant, 315 °C (600 °F) Unfilled
SAE Technical Papers | 2016
SAE Technical Papers | 1996
SAE Technical Papers | 1992