This paper describes the packaging impacts of forecast advances in automotive electronics in two significant areas: In particular, the thermal and EMC issues resulting from these advances are discussed, and practical, cost effective, automotive relevant, solutions are proposed. To illustrate these issues in a realistic situation, a prototype implementation of a network vehicle controller has been developed.
Packaging for Next Generation Automotive Electronics
Sae Technical Papers
SAE 2004 World Congress & Exhibition ; 2004
2004-03-08
Conference paper
English
Packaging for next generation automotive electronics
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