This paper describes the packaging impacts of forecast advances in automotive electronics in two significant areas: In particular, the thermal and EMC issues resulting from these advances are discussed, and practical, cost effective, automotive relevant, solutions are proposed. To illustrate these issues in a realistic situation, a prototype implementation of a network vehicle controller has been developed.


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    Title :

    Packaging for Next Generation Automotive Electronics


    Additional title:

    Sae Technical Papers


    Contributors:
    Nisbet, M. (author) / Miller, P. (author)

    Conference:

    SAE 2004 World Congress & Exhibition ; 2004



    Publication date :

    2004-03-08




    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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